1 Introduction to the production process of multilayer printed circuit boards and analysis of pollution production links

1. The production section of the circuit graphics negative film

   
   

Introduction:

The film production section is relatively simple. It uses a laser light plotter to directly scan the film with a laser to draw the famous circuit pattern required by the customer, and then obtain the photographic film of the circuit pattern after exposure, development and fixation, for the inner layer , Outer layer circuit production and surface processing use.

2Inner layer graphics production section

3. Chemical copper and copper electroplating section

4. Outer graphics production section

5. Surface processing and forming section

ENIG (Immersive Gold Process):

Gold-Finger:

OSP (Organic Coating):

IS (Immersion Silver):